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We offer flake phenolic novolac resins for use as curing agents for epoxy resins in molding applications. These resins are useful as co-reactants or hardeners for epoxy resins to produce thermoset systems with high-quality, "engineering plastics" properties. The phenolic novolac resins used are non-heat reactive materials by themselves, but have phenolic-OH groups that react with epoxy groups. This base catalyzed reaction produces a crosslinked polyether structure that is highly resistant to chemicals and heat and provides a good moisture-vapor barrier. Since the curing mechanism does not produce by-products, thick sections may be obtained without voids and stresses and with low shrinkage. These properties are advantageous in applications such as molding materials (EMC), laminates (CCL), coatings, and adhesives. Epoxy/phenolic molding materials (EMC) are used to produce encapsulated semiconductors, discrete devises as transistors, capacitors, diodes, rectifiers, and resistors.
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Product Description |
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More Information |
| GP® 2074 |
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Solid novolac resin with low ionic impurities used in the electronic laminating industry.
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E-mail Us
770-593-5907
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| GP® 5300 |
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Modified solid novolac resin with low ionic impurities used in the electronic laminating industry.
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E-mail Us
770-593-5907
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| GP® 5833 |
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Solid novolac resin with low ionic impurities used in the electronic laminating industry. |
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E-mail Us
770-593-5907
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